The demand for IC packaging market is growing steadily due to the favorable policies and growing governmental support. The IC packaging’s main function is to protect the IC chips from environmental factors and ensure that a secure electrical connection for chip mounting on printed circuit boards is established. The advancement in technology like cloud computing, artificial intelligence etc., has created a demand for high speed, low power and high integration IC directly aiding market growth for IC packaging.
The support from the government with incentives and investments to support IC manufacturing, research, development and supply chain is a big push for this market. The growing applications in the automobile sector will also help surge the demand for IC packaging. The increase demand for AI based application across industries like telecommunications, energy, healthcare, finance, manufacturing, transport, aerospace, defense etc., is opening new avenues for IC utilization. With AI, improving semiconductor manufacturing by smoother process, enhanced performance by the chip, lower costs of production and increasing output will help fuel the growth of IC packaging market in the next few years.
ASE, Amkor, SPIL, STATS ChipPac, Powertech Technology, J-devices, UTAC, JECT, ChipMOS, Chipbond, KYEC, STS Semiconductor, Huatian, MPl(Carsem), Nepes, FATC, Walton, Unisem, NantongFujitsu Microelectronics, Hana Micron, Signetics, LINGSEN.
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Published by Shubham Desale
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